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Additional resources for Soldering of Electrical and Electronic Assemblies MIL-HDBK-2000 US DOD

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Stainless tips usually have longer working lives, do not freeze onto iron and are generally easier to change. 3 Tip selection criteria. There are three basic parameters to consider in selecting the soldering iron tip, length, diameter and shape. For maximum iron operating efficiency, the shortest tip which meets the application requirements should be used. As the tip length grows, the working temperature of the tip is reduced. In addition, the tip must always be fully inserted into the iron to maximize the heating element-to-tip heat transfer.

When evaluating infrared reflow systems, potential users should examine their assemblies and the system operation to estimate what percentages of infrared and convective heating are required for effective process operation. e.. the infrared absorption characteristics) will affect the heat absorbed during reflow process. If some parts have I much higher absorption rate than others, hot spots may develop on the assemb”Y* Infrared reflow systems which use a greater percentage of convection heat”ng will help reduce the occurrence of localized hot spots.

Processes such as vapor phase soldering tend to result in course microstructure. 5 Plating porosity. The plating process, depending on a range Of factors, may deposit either porous or fine textured platings. Generally, the faster the metal is plated, the more porous the plating. Porous platings typically allow subsurface oxidation which may result in the appearance of dewetting or nonsolderable parts. If reflowed, the plating will lose its porous nature, will fully cover the copper and will perform much better.

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