By Jennie Hwang
One of the most powerful tendencies within the layout and manufacture of contemporary electronics applications and assemblies is the usage of floor mount know-how in its place for through-hole tech nology. The mounting of digital units and parts onto the skin of a published wiring board or different substrate bargains many benefits over putting the leads of units or parts into holes. From the engineering perspective, a lot larger lead counts with shorter twine and interconnection lengths will be accommo dated. this is often serious in excessive functionality smooth electronics packaging. From the producing standpoint, the appliance of automatic meeting and robotics is far extra adaptable to excessive lead count number floor fastened units and elements. certainly, the insertion of excessive lead count number components into fantastic holes on a substrate may frequently be approximately very unlikely. but, even with those floor mounting merits, the usage of floor mount know-how is usually a challenge, essentially as a result of soldering difficulties. the main useful soldering tools use solder pastes, whose intricacies are often no longer understood via such a lot of these curious about the engineering and manufacture of electronics assemblies. This e-book is the 1st ebook dedicated completely to factors of the extensive mix of the chemical, metallurgical, and rheological ideas which are serious to the profitable use of solder pastes. The serious relation ships among those features are essentially defined and pre sented. during this very good presentation, Dr. Hwang highlights 3 impor tant parts of solder paste technology.
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Additional info for Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Solder joint integrity is the ultimate performance of the solderjoint after the soldering process in terms of mechanical properties, resistance to adverse environment, and its compatibility ,vith service conditions. Each of these areas is discussed in subsequent chapters. A working paste under real-world conditions is quite complex in nature. Its complexity and variability are further augmented by the dependency of performance parameters upon the variables of paste handling and the soldering process.
For convenience, they are grouped into three states of the soldering process: paste state, reflowing state, and post-soldering state. The following outlines the parameters at each state, some of which apply to all types of applications, and some of which only specific applications. Paste State • physical appearance • stability and shelf life • viscosity • cold slump • dispensability through fine needles • screen printability • stencil printability • tack time • adhesion • exposure life • quality and consistency 33 34 Chapter 3 Reflowing State • compatibility with surfaces to be joined • flow property before becoming molten • flow property at and after becoming molten • wettability • dewetting phenomenon • solder balling phenomenon • bridging phenomenon • wicking phenomenon • leaching phenomenon Post-soldering State • residue cleanability • residue corrosivity • electromigration • • • • • • • • • • joint appearance joint voids joint strength joint microstructure joint integrity versus joint integrity versus joint integrity versus joint integrity versus joint integrity versus joint integrity versus mechanical fatigue thermal fatigue thermal expansion coefficient differential intrinsic thermal expansion anisotropy creep corrosion-enhanced fatigue In order to achieve a proper set of performance parameters, in addition to the solder powder part, which is covered in Chapter 4, the basic characteristics of the flux/vehicle syst~m have to be designed accordingly.
1 illustrates the spirit of paste technology. Based on this technology, a number of existing and/ or potential application product lines can be derived, in addition to solder paste. d (powder metallurgy) injection molding and EMI (electromagnetic interference) shielding composite, to cermet thick film, polymer thick film, and brazing paste and adhesive. Each of these product lines has its uniqueness in terms of function, composition, and required processing parameters; however, one thing in common is paste technology.
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