Download Lead-free Solder Interconnect Reliability by Dongkai Shangguan PDF

By Dongkai Shangguan

This e-book presents the main updated wisdom and knowledge to be had at the reliability of lead-free solder interconnects. The content material has been written via major specialists operating during this vital expertise sector. either primary examine and useful issues are addressed. Environmental laws are riding the global adoption of lead-free soldering know-how for electronics packaging, board meeting, and similar production operations. whereas an important quantity of study and improvement paintings has been carried out lately on production matters to let the conversion to lead-free solders, info from reports with regards to the reliability of lead-free solder interconnects are nonetheless rising. Many learn tasks all over the world were undertaken to review lead-free solder reliability below diverse loading stipulations. the result of those reports were pronounced relatively sporadically at a variety of technical meetings.

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Extra resources for Lead-free Solder Interconnect Reliability

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Often, mechanical components are custom-made by small local vendors. The awareness and readiness for RoHS compliance needs to be raised in these areas. Managing component traceability, obsolescence and the gray market is also a challenging task. There is also much work to be done in the technical arena. Design rules need to be further refined for lead-free soldering. Process optimization for high-yield volume manufacturing with lead-free solder is also a critical capability, considering the variety of designs, component types, PWB finishes, and process complexities.

Castello, Lead-Free Solder Flip Chips on FR-4 Substrates with Different PCB Surface Finishes, Underfills and Fluxes, Proceedings of Semicon West 2004, p 31–36 D. Geiger, D. Shangguan, S. Tam, and D. Rooney, Package Stacking in SMT for 3D PCB Assembly, Proceedings of IEEE IEMT 2003, Paper S207P6, July 2003 Y. A. Geiger, and D. Shangguan, Determination of Components’ Candidacy for Second Side Reflow With Lead-Free Solder. Proceedings of ECTC 2005, May 2005, p 970–976 IPC-A-610D, Acceptability of Electronic Assemblies, Feb 2005 IPC-A-610C, Acceptability of Electronic Assemblies, Amendment 1, Nov 2001 M.

D. Shangguan, Strategy for Environmental Leadership in Electronics Manufacturing: Lead-Free and Beyond, Proceedings of the High Level SMT Conference, April 2004 120. D. Shangguan, Lead-Free Transition and Environmental Compliance: Challenges Ahead for the Industry, Global SMT & Packaging, Sept 2004 121. Y. Kariya, C. J. Plumbridge, Tin Pest in Lead-Free Solders, Solder. Surf. Mt. 1361/lsir2005p029 Copyright © 2005 ASM International® All rights reserved. org CHAPTER 2 Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects Zequn Mei, Cisco Systems, Inc.

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