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Solder joint integrity is the ultimate performance of the solderjoint after the soldering process in terms of mechanical properties, resistance to adverse environment, and its compatibility ,vith service conditions. Each of these areas is discussed in subsequent chapters. A working paste under real-world conditions is quite complex in nature. Its complexity and variability are further augmented by the dependency of performance parameters upon the variables of paste handling and the soldering process.
For convenience, they are grouped into three states of the soldering process: paste state, reflowing state, and post-soldering state. The following outlines the parameters at each state, some of which apply to all types of applications, and some of which only specific applications. Paste State • physical appearance • stability and shelf life • viscosity • cold slump • dispensability through fine needles • screen printability • stencil printability • tack time • adhesion • exposure life • quality and consistency 33 34 Chapter 3 Reflowing State • compatibility with surfaces to be joined • flow property before becoming molten • flow property at and after becoming molten • wettability • dewetting phenomenon • solder balling phenomenon • bridging phenomenon • wicking phenomenon • leaching phenomenon Post-soldering State • residue cleanability • residue corrosivity • electromigration • • • • • • • • • • joint appearance joint voids joint strength joint microstructure joint integrity versus joint integrity versus joint integrity versus joint integrity versus joint integrity versus joint integrity versus mechanical fatigue thermal fatigue thermal expansion coefficient differential intrinsic thermal expansion anisotropy creep corrosion-enhanced fatigue In order to achieve a proper set of performance parameters, in addition to the solder powder part, which is covered in Chapter 4, the basic characteristics of the flux/vehicle syst~m have to be designed accordingly.
1 illustrates the spirit of paste technology. Based on this technology, a number of existing and/ or potential application product lines can be derived, in addition to solder paste. d (powder metallurgy) injection molding and EMI (electromagnetic interference) shielding composite, to cermet thick film, polymer thick film, and brazing paste and adhesive. Each of these product lines has its uniqueness in terms of function, composition, and required processing parameters; however, one thing in common is paste technology.
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